MediaTek continues to push boundaries with its Dimensity series, known for breaking performance and technology barriers. In this comparison, we’ll explore the characteristics of two powerful chipsets – the Dimensity 8300 Ultra and the newly unveiled Dimensity 9000 – to understand how they shape the smartphone experience and cater to the demands of the 5G era.
Performance
While both chipsets prioritize performance, the Dimensity 9000 elevates the game with its cutting-edge architecture, providing users with an even more powerful and responsive smartphone experience.
MediaTek Dimensity 8300 Ultra:
The Dimensity 8300 Ultra impresses with its octa-core CPU, featuring a blend of Cortex-A715 performance cores and Cortex-A510 power-efficient cores. Accompanied by the Mali-G615 MC6 GPU, this chipset promises seamless multitasking, gaming, and AI-driven applications.
MediaTek Dimensity 9000:
The Dimensity 9000 takes performance to new heights with an extreme configuration. Its Ultra-Core comprises 1x Arm Cortex-X2 at an impressive 3.05GHz, Super-Cores include 3x Arm Cortex-A710 up to 2.85GHz, and Efficiency Cores consist of 4x Arm Cortex-A510. The chipset also introduces the world’s first Arm Mali-G710 MC10 graphics processor, promising an unparalleled computing experience.
| Specification | Dimensity 8300 Ultra | Dimensity 9000 |
|---|---|---|
| CPU | Octa-core Cortex-A715 & Cortex-A510 | 1x Cortex-X2, 3x Cortex-A710, 4x Cortex-A510 |
| GPU | Mali-G615 MC6 | Arm Mali-G710 MC10 |
| AI Processor | MediaTek APU 590 | MediaTek APU 590 |
| Imaging Processor | MediaTek Imagiq 790 | MediaTek Imagiq 790 |
| Maximum Camera Resolution | 320MP | 320MP |
| Gaming Technologies | MediaTek HyperEngine 5.0 | HyperEngine 5.0 with AI enhancements |
| Manufacturing Process | Not specified | TSMC N4 (4nm-class) |
| Connectivity | MediaTek 5G UltraSave 2.0 | Leading 3GPP Release-16 5G Modem |
AI Capabilities
Equipped with MediaTek APU 590, the Dimensity 8300 Ultra focuses on delivering power-efficient AI processing. Its 5th generation AI processor is designed to enhance AI multimedia, gaming, camera, and social video experiences. The Dimensity 9000 introduces the MediaTek APU 590, offering up to a 4X power efficiency upgrade compared to the previous generation.
With a focus on addressing the latest AI trends, this chipset ensures maximum effective performance in various AI-driven scenarios. The Dimensity 9000 leaps forward in AI capabilities, promising not only power efficiency but also a heightened performance level in AI-related tasks.
Imagining Capabilities
Both chipsets showcase formidable imaging capabilities, but the Dimensity 9000 builds upon its predecessor, promising enhanced HDR video recording and support for even higher megapixel cameras.
Dimensity 8300 Ultra:
Featuring the MediaTek Imagiq 790, the Dimensity 8300 Ultra boasts a powerful 9Gpixel/s ISP, simultaneous triple camera 18-bit HDR video recording, and support for a 320MP camera – a testament to its imaging prowess.
Dimensity 9000:
The Dimensity 9000 introduces an upgraded MediaTek Imagiq 790, offering the world’s first simultaneous triple camera 18-bit HDR video recording and support for an impressive 320MP camera. The chipset emphasizes capturing high-quality content with exceptional power efficiency.
Gaming Technologies
In MediaTek Dimensity 8300 Ultra, Mediatek HyperEngine 5.0 ensures extensive gaming power-efficiency enhancements, including AI-enhanced variable rate shading and industry-first ray tracing SDK for Android. Building on the gaming foundation, the Dimensity 9000 introduces HyperEngine 5.0 with AI-VRS (AI-enhanced variable rate shading) and the industry’s first Hybrid AI-GPU Super Resolution for gaming on Android.
Thus Dimensity 9000 advances gaming technologies, incorporating AI enhancements that aim to deliver a faster, visually appealing, and more power-efficient gaming experience.
Connectivity and Modem
8300 Ultra embraces 5G connectivity with a focus on power-saving enhancements through MediaTek 5G UltraSave 2.0. It supports 3CC Carrier Aggregation (300MHz) and Dual SIM Dual Active technology. As a flagship 5G smartphone industry leader, the Dimensity 9000 introduces the world’s 1st TSMC N4 (4nm-class) Smartphone Chip, providing extreme performance and power efficiency. It features the leading 3GPP Release-16 5G Smartphone Modem, offering incredible peak performance exclusively from sub-6GHz.
FAQ’s
In terms of gaming, how does HyperEngine 5.0 in Dimensity 8300 Ultra differ from HyperEngine 5.0 in Dimensity 9000?
While both chipsets feature HyperEngine 5.0 with gaming power-efficiency enhancements, the Dimensity 9000 introduces AI-VRS (AI-enhanced variable rate shading) and the industry's first Hybrid AI-GPU Super Resolution for gaming on Android. These additions in the Dimensity 9000 aim to further elevate the gaming experience with enhanced visual quality and efficiency.
Bottom Up
Both the Dimensity 8300 Ultra and Dimensity 9000 stand as impressive contenders in MediaTek’s Dimensity series, catering to users seeking cutting-edge performance, AI capabilities, and superior connectivity in the 5G era. The Dimensity 9000, with its advanced architecture, imaging enhancements, and groundbreaking manufacturing process, takes a significant stride forward, promising users an unparalleled flagship smartphone experience.