Qualcomm FastConnect 7900: Revolutionizing Mobile Connectivity

In the fast-growing mobile technology, the Qualcomm FastConnect 7900 emerges as a groundbreaking mobile connectivity system, transcending the boundaries of its predecessor, the 7800, with a leap to a cutting-edge 6nm process node. Expected to hit the market in the second half of 2024, the FastConnect 7900 is poised to redefine the landscape of high-performance connectivity for mobile, computer, and XR devices.

Revolutionizing Connectivity with AI Enhancement

At its core, the FastConnect 7900 is an AI-enhanced connectivity powerhouse, seamlessly integrating Wi-Fi 7, Bluetooth, and Ultra Wideband (UWB) into a single-chip 2×2 configuration. The 6nm process node marks a significant advancement, ensuring extreme power efficiency and longer battery life. This compact redesign encompasses all-new RF Front End Modules (FEMs), further enhancing power savings.

Wi-Fi 7 Redefined for Efficiency

The FastConnect 7900 introduces a redesigned and AI-optimized Wi-Fi 7, setting new standards for power efficiency. The incorporation of advanced RF FEMs not only adds to power savings but also contributes to prolonged battery life. With support for 6GHz, 5GHz, and 2.4GHz bands, the FastConnect 7900 achieves data rates of up to 5.8 Gbps, utilizing 4K QAM modulation and 320MHz channel bandwidth. This innovation brings a 40% reduction in power usage compared to the previous generation.

Comprehensive Proximity Awareness

One of the standout features of the FastConnect 7900 is its comprehensive proximity awareness capabilities. Leveraging technologies such as Wi-Fi Ranging, Bluetooth Channel Sounding, and UWB, users can seamlessly connect with nearby devices, be it earbuds, smart tags, or other mobile devices. The High Band Simultaneous (HBS) Multi-Link ensures efficient and robust connections, laying the foundation for immersive multi-device experiences.

Next-Gen Multi-Device Experiences

The FastConnect 7900 propels multi-device experiences to new heights with all-new RF FEMs, delivering improved Key Performance Indicators (KPIs), high efficiency, and low power consumption. The incorporation of proximity awareness capabilities elevates the user experience, making connectivity seamless and immersive. HBS and HBS Multi-Link are integral to Qualcomm XPAN and Snapdragon Seamless, promising unparalleled connectivity.

Revolutionary Audio Experiences

Audio enthusiasts have much to anticipate with the FastConnect 7900. It introduces support for Qualcomm XPAN and Snapdragon Sound™ Technology Suite, revolutionizing sound experiences. The system enables high-bitrate music streaming over Wi-Fi at ultra-low power, covering a frequency range from 96kHz to 192kHz. Qualcomm XPAN ensures high-quality audio, while HBS utilizes two simultaneous high-band connections for robust audio experiences.

Advanced Security and Standards Compliance

Security is paramount, and the FastConnect 7900 doesn’t disappoint. With 256-bit AES-GCMP and 128-bit AES-CCMP encryption, along with support for WPA3 Personal and Enterprise, the system ensures a secure connectivity environment. Standards compliance, including IEEE 802.15.4z for UWB, Fine Ranging (FiRa), and Car Connectivity Consortium (CCC), positions the FastConnect 7900 as a reliable and forward-looking solution.

Bluetooth 5.4 and Spatial Audio Integration

The FastConnect 7900 embraces Bluetooth 5.4, providing support for Qualcomm aptX audio technology, including aptX Adaptive, aptX Voice, and aptX Lossless. With features like Snapdragon Sound™ technology, low latency Gaming mode, LE Audio, and Spatial Audio, users can indulge in a spectrum of audio experiences, from immersive gaming to high-quality music streaming.


The FastConnect 7900 revolutionizes audio experiences with support for Qualcomm XPAN and Snapdragon Sound™ Technology Suite. Qualcomm XPAN enables high-quality audio, while Snapdragon Sound™ facilitates high-bitrate music streaming over Wi-Fi at ultra-low power, covering a frequency range from 96kHz to 192kHz. These technologies ensure a superior audio experience, from detailed music playback to robust, low-latency gaming audio.

Bottom Up

In conclusion, the Qualcomm FastConnect 7900 emerges as a pinnacle of innovation in mobile connectivity. With its AI-enhanced design, 6nm process node, and seamless integration of Wi-Fi 7, Bluetooth, and UWB, it redefines the standards for high-performance connectivity. From the efficiency of AI-optimized Wi-Fi 7 to comprehensive proximity awareness capabilities and revolutionary audio experiences, the FastConnect 7900 promises a future where connectivity is not just fast but intelligent. Anticipated to hit the market in the second half of 2024, it signifies a quantum leap toward a new era of seamless, immersive, and secure mobile experiences.